Concepedia

Sung K. Kang

SK

34

Publications

2.2K

Citations

22

H-Index

1977

Active since

Affiliations

IBM (United States)(Current)

Korea Advanced Institute of Science and Technology

IBM Research - Thomas J. Watson Research Center

Samsung (South Korea)

Endicott College

Sung K. Kang is an author at IBM (United States) specializing in engineering, materials science, and materials engineering.

Top concepts

Publications per year

1977–2020

34

Publications

34

Lead (Pb)-free solders for electronic packaging

Sung K. Kang, Amit Sarkhel · Journal of Electronic Materials · 1994 · 331 citations

, , +3

Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

Donald W. Henderson, Timothy Gosselin, Amit Sarkhel et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 198 citations

, , +6

The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

Donald W. Henderson, James J. Woods, Timothy Gosselin et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 197 citations

, , +6

Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

Sung K. Kang, Da‐Yuan Shih, NY. Donald et al. · JOM · 2003 · 163 citations

, , +6

Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

Sung K. Kang, Da‐Yuan Shih, Donovan N. Leonard et al. · JOM · 2004 · 156 citations

, , +10

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