Sung K. Kang - Concepedia

Author

Sung K. Kang

IBM (United States)

Also Known As

Sung "Pil" Kang, Sung K. Kang, Sung Kang, Sung Kwan Kang, Sung-Kwan Kang, Sungkwan Kang

Publications

2.3K

Citations

H-Index

Concepts

All Affiliations

IBM (United States)Korea Advanced Institute of Science and Technology IBM Research - Thomas J. Watson Research Center Samsung (South Korea)Endicott College

About

Sung K. Kang is an author at IBM (United States) specializing in engineering, materials science, and materials engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	22	32	2.2K
2	Applied Physics	11	13	802
3	Electrical Engineering	8	8	522
4	Chemical Engineering	5	5	366
5	Chemistry	5	5	297

Sung K. Kang

Publications

2.2K

Citations

H-Index

Page 1

	Year	Citations
Lead (Pb)-free solders for electronic packaging Sung K. Kang, Amit Sarkhel Journal of Electronic Materials Materials ScienceElectrical EngineeringEngineeringChip On BoardLead Identification	1994	331
Ag<sub>3</sub>Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys Donald W. Henderson, Timothy Gosselin, Amit Sarkhel, Journal of materials research/Pratt's guide to venture capital sources Materials EngineeringMaterials ScienceEngineeringApplied PhysicsAlloy Design	2002	198
The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue Donald W. Henderson, James J. Woods, Timothy Gosselin, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringAlloy Design	2004	197
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu Sung K. Kang, Da‐Yuan Shih, NY. Donald, JOM Materials ScienceMaterials EngineeringEngineeringAg3sn Plate FormationSolid-state Chemistry	2003	163
Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying Sung K. Kang, Da‐Yuan Shih, Donovan N. Leonard, JOM Materials ScienceMaterials EngineeringEngineeringCorrosionAg3sn Plate Formation	2004	156
Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging Moon Gi Cho, Sung K. Kang, Da‐Yuan Shih, Journal of Electronic Materials Materials EngineeringMaterials ScienceChemical EngineeringMinor AdditionsEngineering	2007	138
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition Sung K. Kang, Donovan N. Leonard, Da‐Yuan Shih, Journal of Electronic Materials Materials ScienceMaterials EngineeringChemical EngineeringMinor ZnInterfacial Reactions	2006	105
Color Based Hand and Finger Detection Technology for User Interaction Sung K. Kang, Mi Young Nam, Phill Kyu Rhee Finger Detection TechnologyEngineeringAssistive TechnologyHand DetectionFinger Tip	2008	93
Oxidation study of pure tin and its alloys via electrochemical reduction analysis Cho Sungil, Jin Yu, Sung K. Kang, Journal of Electronic Materials Materials ScienceMaterials EngineeringChemical EngineeringPure TinElectrochemical Reduction Analysis	2005	83
The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging Sun-Kyoung Seo, Sung K. Kang, Da‐Yuan Shih, Microelectronics Reliability Materials ScienceMaterials EngineeringHigh Temperature MaterialsEngineeringApplied Physics	2009	79

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