Concepedia

Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

Sung K. Kang, Da‐Yuan Shih, NY. Donald, Wesley A. Henderson, Timothy Gosselin, Amit Sarkhel, NY. Charles Goldsmith, Karl J. Puttlitz, Won Kyoung Choi

JOM · 2003 · 163 citations · 9 references

DOI

Concepts

References

9

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Kil-Won Moon, W. J. Boettinger, Ursula R. Kattner et al. · Journal of Electronic Materials · 2000 · 548 citations

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Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

K.S Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Materials Science and Engineering A · 2002 · 374 citations

, , +8

Pb-free solders for flip-chip interconnects

D. R. Frear, Jihun Jang, J. K. Lin et al. · JOM · 2001 · 316 citations

, , +5

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

, , +4

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

Iver E. Anderson, J. C. Foley, B. A. Cook et al. · Journal of Electronic Materials · 2001 · 211 citations

, , +7