Concepedia

Seok‐Hwan Huh

SH

11

Publications

1.5K

Citations

10

H-Index

2001

Active since

Affiliations

The University of Osaka(Current)

Changwon National University

Osaka Research Institute of Industrial Science and Technology

King Faisal University

Seok‐Hwan Huh is an author at The University of Osaka specializing in engineering, materials science, and mechanical engineering.

ORCID

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Publications per year

2001–2023

11

Publications

11

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 607 citations

, , +4

Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

K.S Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Materials Science and Engineering A · 2002 · 374 citations

, , +8

Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Microelectronics Reliability · 2003 · 287 citations

, , +8

Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder

Seok‐Hwan Huh, Keun‐Soo Kim, Katsuaki Suganuma · MATERIALS TRANSACTIONS · 2001 · 88 citations · Full text

, , +18

LBL generated fire retardant nanocomposites on cotton fabric using cationized starch-clay-nanoparticles matrix

Zeeshan Ur Rehman, Seok‐Hwan Huh, Zakir Ullah et al. · Carbohydrate Polymers · 2021 · 62 citations

, , +8

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