Concepedia

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

Iver E. Anderson, J. C. Foley, B. A. Cook, J. L. Harringa, Robert L Terpstra, Ö. Ünal

Journal of Electronic Materials · 2001 · 213 citations · 8 references

DOI

Concepts

References

8

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Kil-Won Moon, W. J. Boettinger, Ursula R. Kattner et al. · Journal of Electronic Materials · 2000 · 557 citations

, , +14

The structure of metals and alloys

Robert B. Gordon · Materials Science and Engineering · 1969 · 527 citations

, , +10

A viable tin-lead solder substitute: Sn-Ag-Cu

Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations

, , +9

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

Iver E. Anderson, J. C. Foley, B. A. Cook et al. · Journal of Electronic Materials · 2001 · 213 citations

, , +14

Undercooled alloy phases

慶一 石原 · Medical Entomology and Zoology · 1987 · 180 citations