Concepedia
1
Publications
261
Citations
H-Index
1994
Active since
Affiliations
Iowa State University(Current)
Chad M. Miller is an author at Iowa State University specializing in electronic packaging, materials engineering, and corrosion.
Top concepts
CorrosionEngineeringMaterial ScienceElectronic PackagingMaterials Engineering
Publications per year
1994–1994
A viable tin-lead solder substitute: Sn-Ag-Cu
Chad M. Miller, Iver E. Anderson, Jack Smith · Journal of Electronic Materials · 1994 · 261 citations
Materials Science, Materials Engineering, Engineering +4
Rows per page
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