A viable tin-lead solder substitute: Sn-Ag-Cu

Binary phase diagrams

Alan F. Berndt · Journal of Chemical Education · 1969 · 432 citations

Management, Educational Assessment, Mass Communication +6

The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solder

D. R. Frear, D. Grivas, J. W. Morris · Journal of Electronic Materials · 1987 · 99 citations

Natural Sciences, Materials Engineering, Materials Science +5

Flow mechanisms in high pressure gas atomization

Iver E. Anderson, Richard Figliola, Harold S. Morton · Materials Science and Engineering A · 1991 · 87 citations

Engineering, Chemical Engineering, Physics +14

The properties of tin-bismuth alloy solders

L.E. Felton, C. H. Raeder, D. B. Knorr · JOM · 1993 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +9

A thermodynamic analysis of the AlZn system and phase diagram calculation

Shuanglin Chen, Y. A. Chang · Calphad · 1993 · 79 citations

Natural Sciences, Materials Science, Phase Transformations +15