D. B. Knorr

Correlation of texture with electromigration behavior in Al metallization

D. B. Knorr, D. P. Tracy, Kenneth P. Rodbell · Applied Physics Letters · 1991 · 136 citations

Materials Science, Materials Engineering, Electromigration Technique +15

The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints

C. H. Raeder, L.E. Felton, V. A. Tanzi et al. · Journal of Electronic Materials · 1994 · 123 citations

Materials Science, Materials Engineering, Sn-bi/cu Solder Joints +12

Texture and microstructure of thin copper films

D. P. Tracy, D. B. Knorr · Journal of Electronic Materials · 1993 · 121 citations

Materials Science, Engineering, Surface Science +5

Texture in multilayer metallization structures

D. P. Tracy, D. B. Knorr, Kenneth P. Rodbell · Journal of Applied Physics · 1994 · 111 citations

Materials Science, Materials Engineering, Normal Grain Growth +14

The role of texture in the electromigration behavior of pure aluminum lines

D. B. Knorr, Kenneth P. Rodbell · Journal of Applied Physics · 1996 · 82 citations

Engineering, Mechanical Engineering, Mass Transport +20