Concepedia

Solder Pastes

Solder Pastes is a viscous composite material consisting of powdered solder alloy suspended in flux medium, distinguished by its use in forming electrical and mechanical connections in surface mount technology through controlled reflow soldering processes.

949

Publications

36.4K

Citations

2.6K

Authors

648

Institutions

Publications per year

2017–2026

199

Variants

Solder Paste

Parents

Publications

949

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 589 citations

, , +10

A review: On the development of low melting temperature Pb-free solders

Hiren R. Kotadia, Philip D. Howes, S.H. Mannan · Microelectronics Reliability · 2014 · 465 citations

, , +11

Fabrication of a Cylindrical Display by Patterned Assembly

Heiko O. Jacobs, Andrea R. Tao, Alexander Schwartz et al. · Science · 2002 · 392 citations

, , +16

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

John G. Bai, Ziyang Zhang, Jesus N. Calata et al. · IEEE Transactions on Components and Packaging Technologies · 2006 · 370 citations

, , +17

High-temperature lead-free solders: Properties and possibilities

Katsuaki Suganuma, Seongjun Kim, Keun‐Soo Kim · JOM · 2009 · 347 citations

, , +10

1–5 of 949

Authors

2.6K

  1. NE
    N.N. Ekere

    University of Greenwich, United Kingdom

    37 publications · 1K citations

    19

    h-index

  2. SJ
    Seung‐Boo Jung

    Sungkyunkwan University, South Korea

    24 publications · 789 citations

    18

    h-index

  3. YC
    Y.C. Chan

    City University of Hong Kong, Hong Kong SAR China

    18 publications · 1.1K citations

    16

    h-index

  4. JY
    Jeong‐Won Yoon

    Sungkyunkwan University, South Korea

    17 publications · 572 citations

    14

    h-index

  5. RD
    R. Durairaj

    Universiti Tunku Abdul Rahman, Malaysia

    16 publications · 485 citations

    13

    h-index

1–5 of 2.6K

Institutions

648

  1. City University of Hong Kong

    Hong Kong, Hong Kong

    24 h-index

    98 publications

    5.5K citations

  2. The University of Osaka

    Osaka, Japan

    19 h-index

    55 publications

    3.1K citations

  3. Harbin Institute of Technology

    Harbin, China

    19 h-index

    97 publications

    4.2K citations

  4. Sungkyunkwan University

    Seoul, South Korea

    18 h-index

    79 publications

    2.4K citations

  5. Binghamton University

    Binghamton, United States

    17 h-index

    98 publications

    2.6K citations

  6. Korea Advanced Institute of Science and Technology

    Daejeon, South Korea

    16 h-index

    51 publications

    2.4K citations

  7. Nanjing University of Aeronautics and Astronautics

    Nanjing, China

    15 h-index

    84 publications

    3.2K citations

  8. University of Greenwich

    London, United Kingdom

    15 h-index

    85 publications

    2.6K citations

1–8 of 648

Venues

  1. Journal of Electronic Materials

    JEM · 131 publications · 5.5K citations

    45

    h-index

  2. Journal of Alloys and Compounds

    60 publications · 3.5K citations

    37

    h-index

  3. Microelectronics Reliability

    46 publications · 2.8K citations

    28

    h-index

  4. 27

    h-index

  5. Soldering and Surface Mount Technology

    61 publications · 1.6K citations

    21

    h-index

1–5