High-temperature lead-free solders: Properties and possibilities

Advances in lead-free electronics soldering

Katsuaki Suganuma · Current Opinion in Solid State and Materials Science · 2001 · 725 citations

Engineering, Materials Engineering, Materials Science +7

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Yi Li, C.P. Wong · Materials Science and Engineering R Reports · 2006 · 706 citations

Natural Sciences, Materials Engineering, Materials Science +17

Physics and materials challenges for lead-free solders

K. N. Tu, Andriy Gusak, M. Li · Journal of Applied Physics · 2003 · 356 citations

Engineering, Materials Engineering, Materials Science +17

Wetting and interface microstructure between Sn–Zn binary alloys and Cu

Katsuaki Suganuma, Koichi Niihara, Takeshi Shoutoku et al. · Journal of materials research/Pratt's guide to venture capital sources · 1998 · 216 citations

Natural Sciences, Materials Engineering, Materials Science +14

Alloy design of Zn–Al–Cu solder for ultra high temperatures

Namhyun Kang, Hye Sung Na, Seong Jun Kim et al. · Journal of Alloys and Compounds · 2007 · 125 citations

Natural Sciences, Materials Engineering, Materials Science +14