Concepedia
1
Publications
124
Citations
H-Index
2007
Active since
Affiliations
The University of Osaka(Current)
Seong Jun Kim is an author at The University of Osaka specializing in materials engineering, engineering, and high temperature materials.
Top concepts
EngineeringMaterial ScienceMaterials EngineeringHigh Temperature Materials
Publications per year
2007–2007
Alloy design of Zn–Al–Cu solder for ultra high temperatures
Namhyun Kang, Hye Sung Na, Seong Jun Kim et al. · Journal of Alloys and Compounds · 2007 · 124 citations
Materials Engineering, Materials Science, High Temperature Materials +2
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