Publication | Closed Access
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
701
Citations
59
References
2006
Year
Materials EngineeringAdvanced PackagingElectrical EngineeringMaterials ScienceConductive AdhesivesEngineeringAdhesive MaterialActive PackagingLead-free AlternativePrinted ElectronicsAdhesive MaterialsElectronic PackagingRecent AdvancesElectrical InsulationStructural Adhesive
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