Concepedia

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Yi Li, C.P. Wong

Materials Science and Engineering R Reports · 2006 · 706 citations · 59 references

DOI

Concepts

References

59

Handbook of chemistry and physics

Journal of the Franklin Institute · 1930 · 11.7K citations

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Encyclopedia of polymer science and technology

Choice Reviews Online · 2003 · 5.1K citations

, , +12

Handbook of chemistry and physics

G. Milazzo · Journal of Electroanalytical Chemistry (1959) · 1961 · 2.5K citations

, , +8

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

, , +9

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

, , +15