Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Yi Li, C.P. Wong

Materials Science and Engineering R Reports

Materials EngineeringAdvanced PackagingElectrical EngineeringMaterials ScienceConductive Adhesives +10

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

Kyoung‐sik Moon, Hai Dong, Radenka Marić, +4

Journal of Electronic Materials

Materials ScienceEngineeringNanomaterialsNanotechnologySilver Nanoparticles +7

First-principles insight into Ni-doped InN monolayer as a noxious gases scavenger

Hao Cui, Xiaoxing Zhang, Yi Li, +2

Applied Surface Science

EngineeringPhysicsNi-doped Inn MonolayerNanotechnologyNatural Sciences +10

High-performance ammonia oxidation catalysts for anion-exchange membrane direct ammonia fuel cells

Yi Li, Hemanth Somarajan Pillai, Teng Wang, +11

Energy & Environmental Science

Catalytic MembraneChemical EngineeringEngineeringWide AvailabilityEasy Transport +11

Insulating materials for realising carbon neutrality: Opportunities, remaining issues and challenges

Chuanyang Li, Yang Yang, Guoqiang Xu, +25

High Voltage

Facile electron delivery from graphene template to ultrathin metal-organic layers for boosting CO2 photoreduction

Jia‐Wei Wang, Lizhen Qiao, Haodong Nie, +7

Nature Communications

Breathable Nanogenerators for an On-Plant Self-Powered Sustainable Agriculture System

Lingyi Lan, Jiaqing Xiong, Dace Gao, +6

ACS Nano

Cadmium and lead contamination in japonica rice grains and its variation among the different locations in southeast China

Cheng Fangmin, Zhao NingChun, Haiming Xu, +4

The Science of The Total Environment

Environmental ChemistryEngineeringEnvironmental EngineeringMetalloid ContaminationMetal Contamination +10

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Myung Jin Yim, Yi Li, Kyoung‐sik Moon, +2

Journal of Adhesion Science and Technology

Flip Chip TechnologyEngineeringThin Film Process TechnologyAcf MaterialsAdvanced Packaging (Semiconductors) +17

Flexible multilayered films consisting of alternating nanofibrillated cellulose/Fe3O4 and carbon nanotube/polyethylene oxide layers for electromagnetic interference shielding

Yi Li, Bai Xue, Shengdu Yang, +3

Chemical Engineering Journal

Materials ScienceEngineeringFlexible ElectronicsNanomaterialsApplied Physics +3