Yi Li

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Yi Li, C.P. Wong · Materials Science and Engineering R Reports · 2006 · 706 citations

Natural Sciences, Materials Engineering, Materials Science +17

Thermal behavior of silver nanoparticles for low-temperature interconnect applications

Kyoung‐sik Moon, Hai Dong, Radenka Marić et al. · Journal of Electronic Materials · 2005 · 380 citations

Engineering, Materials Engineering, Materials Science +16

First-principles insight into Ni-doped InN monolayer as a noxious gases scavenger

Hao Cui, Xiaoxing Zhang, Yi Li et al. · Applied Surface Science · 2019 · 329 citations

Natural Sciences, Materials Science, Physics +12

High-performance ammonia oxidation catalysts for anion-exchange membrane direct ammonia fuel cells

Yi Li, Hemanth Somarajan Pillai, Teng Wang et al. · Energy & Environmental Science · 2021 · 228 citations · Full text

Natural Sciences, Chemical Engineering, Chemistry +4

Insulating materials for realising carbon neutrality: Opportunities, remaining issues and challenges

Chuanyang Li, Yang Yang, Guoqiang Xu et al. · High Voltage · 2022 · 211 citations · Full text

Engineering, Electrical Engineering, Materials Science +16