Concepedia

Advanced Packaging

Advanced Packaging is a semiconductor integration technology that, unlike conventional packaging methods, enables higher performance, miniaturization, and improved interconnect density through three-dimensional stacking, heterogeneous integration, and fine-pitch interconnects.

1.2K

Publications

43.2K

Citations

4.6K

Authors

648

Institutions

Publications per year

2017–2026

311

Parents

Publications

1.2K

Millimeter-Wave Technology for Automotive Radar Sensors in the 77 GHz Frequency Band

Jürgen Hasch, Eray Topak, Raik Schnabel et al. · IEEE Transactions on Microwave Theory and Techniques · 2012 · 1.3K citations

, , +17

Recent Advances and Trends in Advanced Packaging

John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 585 citations

, , +15

Foreword contributions from the 50th electronic components and technology conference

R. Boudreau · IEEE Transactions on Advanced Packaging · 2001 · 519 citations

, , +16

Vertically Aligned and Interconnected Graphene Networks for High Thermal Conductivity of Epoxy Composites with Ultralow Loading

Gang Lian, Chia‐Chi Tuan, Liyi Li et al. · Chemistry of Materials · 2016 · 378 citations

, , +17

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Ravi Mahajan, Robert Sankman, Neha Patel et al. · 2016 · 357 citations

, , +17

1–5 of 1.2K

Authors

4.6K

  1. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    42 publications · 2.8K citations

    22

    h-index

  2. RT
    Rao Tummala

    Georgia Institute of Technology, United States

    35 publications · 1.4K citations

    20

    h-index

  3. HR
    H. Reichl

    Fraunhofer Institute for Reliability and Microintegration, Germany

    24 publications · 652 citations

    17

    h-index

  4. SW
    Seung Wook Yoon

    Institute of Microelectronics, Singapore

    24 publications · 771 citations

    17

    h-index

  5. EB
    Eric Beyne

    IMEC, Belgium

    20 publications · 774 citations

    16

    h-index

1–5 of 4.6K

Institutions

648

  1. Georgia Institute of Technology

    Atlanta, United States

    28 h-index

    343 publications

    13.6K citations

  2. IBM (United States)

    Armonk, United States

    25 h-index

    219 publications

    10.8K citations

  3. Industrial Technology Research Institute

    Hsinchu, Taiwan

    21 h-index

    244 publications

    6.1K citations

  4. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    21 h-index

    226 publications

    6.2K citations

  5. IBM Research - Thomas J. Watson Research Center

    Yorktown Heights, United States

    21 h-index

    183 publications

    15.6K citations

  6. Institute of Microelectronics

    Singapore, Singapore

    20 h-index

    206 publications

    7K citations

  7. Intel (United States)

    Santa Clara, United States

    19 h-index

    135 publications

    9K citations

  8. Technische Universität Berlin

    Berlin, Germany

    18 h-index

    81 publications

    2.6K citations

1–8 of 648

Venues

  1. 25

    h-index

  2. IEEE Transactions on Advanced Packaging

    39 publications · 1.9K citations

    21

    h-index

  3. Microelectronics Reliability

    29 publications · 1K citations

    21

    h-index

  4. 17

    h-index

  5. Journal of Electronic Packaging

    18 publications · 1.5K citations

    13

    h-index

1–5