Robert Sankman

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Ravi Mahajan, Robert Sankman, Neha Patel et al. · 2016 · 344 citations

Emib Assembly Process, Engineering, Device Integration +16

A Sub-cm³ Energy-Harvesting Stacked Wireless Sensor Node Featuring a Near-Threshold Voltage IA-32 Microcontroller in 14-nm Tri-Gate CMOS for Always-ON Always-Sensing Applications

Somnath Paul, Vinayak Honkote, Ryan Kim et al. · IEEE Journal of Solid-State Circuits · 2017 · 58 citations

Engineering, Wireless Sensor System, 14-Nm Tri-gate Cmos +16

An energy harvesting wireless sensor node for IoT systems featuring a near-threshold voltage IA-32 microcontroller in 14nm tri-gate CMOS

Somnath Paul, Vinayak Honkote, Ryan Kim et al. · 2016 · 25 citations

Smart Sensor, Engineering, Wireless Sensor System +18

High performance package designs for a 1 GHz microprocessor

A. Hasan, A. Sarangi, Chris Baldwin et al. · IEEE Transactions on Advanced Packaging · 2001 · 15 citations

System On Chip, Electrical Engineering, Physical Design (Electronics) +14

Advances and Challenges in Flip-Chip Packaging

Ravi Mahajan, Debendra Mallik, Robert Sankman et al. · 2006 · 11 citations

Engineering, Computer Architecture, Hardware Security +16