Debendra Mallik

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Ravi Mahajan, Robert Sankman, Neha Patel et al. · 2016 · 357 citations

Engineering, Computer Engineering, Electrical Engineering +17

A Sub-cm³ Energy-Harvesting Stacked Wireless Sensor Node Featuring a Near-Threshold Voltage IA-32 Microcontroller in 14-nm Tri-Gate CMOS for Always-ON Always-Sensing Applications

Somnath Paul, Vinayak Honkote, Ryan Kim et al. · IEEE Journal of Solid-State Circuits · 2017 · 59 citations

Engineering, Computer Engineering, Electrical Engineering +17

Advanced Package Technologies for High-Performance Systems

Debendra Mallik · Intel Technology Journal · 2005 · 45 citations

Engineering, Computer Engineering, Electrical Engineering +17

Critical Aspects of High-Performance Microprocessor Packaging

Vasudeva Prasad Atluri, Ravi Mahajan, Priyavadan R. Patel et al. · MRS Bulletin · 2003 · 30 citations

Engineering, Computer Engineering, Computer Systems +14

An energy harvesting wireless sensor node for IoT systems featuring a near-threshold voltage IA-32 microcontroller in 14nm tri-gate CMOS

Somnath Paul, Vinayak Honkote, Ryan Kim et al. · 2016 · 25 citations

Engineering, Computer Engineering, Electrical Engineering +17