Vertically Aligned and Interconnected Graphene Networks for High Thermal Conductivity of Epoxy Composites with Ultralow Loading

TLDR

Efficient heat removal via thermal interface materials is a critical challenge for modern microelectronics, yet traditional polymer composites exhibit limited thermal conductivity even when heavily loaded with conductive fillers due to insufficient heat transfer channels. The study aims to employ vertically aligned and interconnected graphene networks as a filler to improve the thermal conductivity of epoxy composites. The graphene networks are fabricated through a controlled three‑step process: forming graphene oxide liquid crystals, oriented freeze casting, and high‑temperature annealing reduction under Ar. The composite achieves a thermal conductivity of 2.13 W m⁻¹ K⁻¹ (a 1231 % increase over the matrix) at only 0.92 vol % graphene, while also reducing the coefficient of thermal expansion to ~37.4 ppm K⁻¹ and raising the glass transition temperature to 135.4 °C, demonstrating a promising route for high‑performance electronic packaging.

Abstract

Efficient removal of heat via thermal interface materials has become one of the most critical challenges in the development of modern microelectronic devices. However, traditional polymer composites present limited thermal conductivity even when highly loaded with highly thermally conductive fillers due to the lack of efficient heat transfer channels. In this work, vertically aligned and interconnected graphene networks are first used as the filler, which is prepared by a controlled three-step procedure: formation of graphene oxide liquid crystals, oriented freeze casting, and high-temperature annealing reduction under Ar. The obtained composite, at an ultralow graphene loading of 0.92 vol %, exhibits a high thermal conductivity (2.13 W m–1 K–1) that is equivalent to a dramatic enhancement of 1231% compared to the pure matrix. Furthermore, the composite also presents a much reduced coefficient of thermal expansion (∼37.4 ppm K–1) and increased glass transition temperature (135.4 °C). This strategy provides an insight for the design of high-performance composites with potential to be used in advanced electronic packaging.