IEEE Transactions on Components Packaging and Manufacturing Technology

Recent Advances and Trends in Advanced Packaging

John H. Lau · 2022 · 585 citations

Engineering, Electrical Engineering, Electronic Materials +15

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim, Jun So Pak, Jonghyun Cho et al. · 2011 · 487 citations

Engineering, Electrical Engineering, Circuit Theory +16

3-D Printed Metal-Pipe Rectangular Waveguides

Mario D’Auria, William J. Otter, J. Hazell et al. · 2015 · 297 citations · Full text

Engineering, Electrical Engineering, Manufacturing Engineering +16

Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

Vijay Sukumaran, Tapobrata Bandyopadhyay, Venky Sundaram et al. · 2012 · 273 citations

Engineering, Electrical Engineering, Materials Science +17

Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Suresh V. Garimella, Tim Persoons, Justin A. Weibel et al. · 2016 · 243 citations · Full text

Engineering, Electrical Engineering, High-performance Computing +17