Tapobrata Bandyopadhyay

Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

Vijay Sukumaran, Tapobrata Bandyopadhyay, Venky Sundaram et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 273 citations

Engineering, Electrical Engineering, Materials Science +17

Through-package-via formation and metallization of glass interposers

Vijay Sukumaran, Qiao Chen, Fuhan Liu et al. · 2010 · 123 citations

Engineering, Materials Engineering, Materials Science +17

Electrical modeling of Through Silicon and Package Vias

Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung et al. · 2009 · 123 citations

Engineering, Electrical Engineering, Circuit Theory +16

Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects

Tapobrata Bandyopadhyay, Ki Jin Han, Daehyun Chung et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 104 citations

Engineering, Computer Engineering, Electrical Engineering +17

Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions

Ki Jin Han, Madhavan Swaminathan, Tapobrata Bandyopadhyay · IEEE Transactions on Advanced Packaging · 2010 · 104 citations

Engineering, Electrical Engineering, Circuit Theory +14