Vijay Sukumaran

Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

Vijay Sukumaran, Tapobrata Bandyopadhyay, Venky Sundaram et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 262 citations

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

Vijay Sukumaran, Gokul Kumar, Koushik Ramachandran et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 135 citations

Engineering, Signal Insertion Loss, Integrated Circuits +18

Through-package-via formation and metallization of glass interposers

Vijay Sukumaran, Qiao Chen, Fuhan Liu et al. · 2010 · 119 citations

Engineering, Silicon Interposers, Glass-ceramic +17

Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

Vijay Sukumaran, Tapobrata Bandyopadhyay, Qiao Chen et al. · 2011 · 81 citations

Package Vias, Engineering, Fine Pitch +21

Trend from ICs to 3D ICs to 3D systems

Rao Tummala, Venky Sundaram, Ritwik Chatterjee et al. · 2009 · 57 citations

Engineering, Computer Architecture, 3D Modeling +18