Gokul Kumar

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

Vijay Sukumaran, Gokul Kumar, Koushik Ramachandran et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 135 citations

Engineering, Signal Insertion Loss, Integrated Circuits +18

3D-MAPS: 3D Massively parallel processor with stacked memory

Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy et al. · 2012 · 117 citations

Engineering, Computer Architecture, Computer-aided Design +23

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)

Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy et al. · IEEE Transactions on Computers · 2013 · 64 citations

Engineering, Vlsi Design, Memory Tier +24

Ultra-high I/O density glass/silicon interposers for high bandwidth smart mobile applications

Gokul Kumar, Tapobrata Bandyopadhyay, Vijay Sukumaran et al. · 2011 · 51 citations

Engineering, Vlsi Design, Device Integration +19

Low-cost and low-loss 3D silicon interposer for high bandwidth logic-to-memory interconnections without TSV in the logic IC

Venky Sundaram, Qiao Chen, Yuya Suzuki et al. · 2012 · 35 citations

Engineering, Vlsi Design, Device Integration +17