Gokul Kumar - Concepedia

Author

Gokul Kumar

Georgia Institute of Technology

Also Known As

G. Charan Kumar, G. Hareesh Kumar, G. Kumar, Gokul Kumar, Gopikrishnan Nair Suresh Kumar

Publications

480

Citations

H-Index

Concepts

All Affiliations

Georgia Institute of Technology Korea Advanced Institute of Science and Technology Amkor Technology (United States)

About

Gokul Kumar is an author at Georgia Institute of Technology specializing in engineering, microelectronics, and 3d printing.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	446
2	Computer Engineering	5	5	284
3	Natural Sciences	2	2	181
4	Applied Physics	2	2	186
5	Computer Science	2	2	181

Gokul Kumar

Publications

446

Citations

H-Index

Page 1

	Year	Citations
Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon Vijay Sukumaran, Gokul Kumar, Koushik Ramachandran, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringSignal Insertion LossIntegrated CircuitsSame PitchInterconnect (Integrated Circuits)	2014	135
3D-MAPS: 3D Massively parallel processor with stacked memory Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, EngineeringComputer ArchitectureComputer-aided DesignIntegrated CircuitsMulti-channel Memory Architecture	2012	117
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory) Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, IEEE Transactions on Computers EngineeringVlsi DesignMemory TierComputer ArchitectureComputer-aided Design	2013	64
Ultra-high I/O density glass/silicon interposers for high bandwidth smart mobile applications Gokul Kumar, Tapobrata Bandyopadhyay, Vijay Sukumaran, EngineeringVlsi DesignDevice IntegrationComputer ArchitectureSilicon On Insulator	2011	51
Low-cost and low-loss 3D silicon interposer for high bandwidth logic-to-memory interconnections without TSV in the logic IC Venky Sundaram, Qiao Chen, Yuya Suzuki, EngineeringVlsi DesignDevice IntegrationComputer ArchitectureLow-loss 3D	2012	35
Modeling, Fabrication, and Characterization of Low-Cost and High-Performance Polycrystalline Panel-Based Silicon Interposer With Through Vias and Redistribution Layers Qiao Chen, Yuya Suzuki, Gokul Kumar, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringThrough ViasIntegrated CircuitsRedistribution LayersInterconnect (Integrated Circuits)	2014	27
Design and Demonstration of Power Delivery Networks With Effective Resonance Suppression in Double-Sided 3-D Glass Interposer Packages Gokul Kumar, Srikrishna Sitaraman, Jonghyun Cho, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringIntegrated CircuitsPower ElectronicsInterconnect (Integrated Circuits)Electromagnetic Compatibility	2015	17

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