Concepedia
Statistics
Publications
546
Citations
15.1K
Authors
135
Location
Tempe, United States
Amkor Technology (United States) is a company institution in Tempe, United States known for engineering, materials science, and materials engineering.
Top concepts
EngineeringChip PackagingMaterials ScienceMaterials EngineeringPackaging EngineeringPackaging DesignIntegrated Circuit DesignSemiconductor DevicesElectronic MaterialsComputer Engineering
Amkor Technology (United States), United States
73 publications · 2.6K citations
20
h-index
59 publications · 555 citations
14
38 publications · 532 citations
11
34 publications · 776 citations
18 publications · 707 citations
9
1–5 of 135
Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints
A. Syed · 2004 · 353 citations
Engineering, Materials Engineering, Materials Science +17
Performance evaluation of commercial short-oligonucleotide microarrays and the impact of noise in making cross-platform correlations
Richard Shippy, Timothy J. Sendera, Randall Lockner et al. · BMC Genomics · 2004 · 154 citations · Full text
Life Sciences, Biotechnology, Molecular Biology +13
Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages
Yaojiang Zhang, Jun Fan, G. Selli et al. · IEEE Transactions on Microwave Theory and Techniques · 2008 · 152 citations
Engineering, Electrical Engineering, Circuit Theory +15
Model for BGA and CSP Reliability in Automotive Underhood Applications
Pradeep Lall, Md Nazmul Islam, Naveen K. Singh et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 137 citations
Engineering, Automotive Engineering, Materials Engineering +17
An Efficient Approach for Power Delivery Network Design With Closed-Form Expressions for Parasitic Interconnect Inductances
Cheng‐Xiang Wang, Jie Mao, G. Selli et al. · IEEE Transactions on Advanced Packaging · 2006 · 128 citations
Engineering, Electrical Engineering, Circuit Theory +16
1–5 of 546