Ahmer Syed

High temperature lead-free solder for microelectronics

Frank W. Gayle, G.A. Becka, Ahmer Syed et al. · JOM · 2001 · 72 citations

Natural Sciences, Materials Engineering, Materials Science +9

Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach

Ahmer Syed · Journal of Electronic Packaging · 1995 · 45 citations

Engineering, Materials Engineering, Materials Science +17

Solder joint fatigue life of fine pitch BGAs – impact of design and material choices

Robert Darveaux, Jim Heckman, Ahmer Syed et al. · Microelectronics Reliability · 2000 · 45 citations

Natural Sciences, Materials Engineering, Materials Science +13

Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish

Ahmer Syed, Tae‐il Kim, Young Cho et al. · 2006 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +16

Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps

Ahmer Syed, D. Karthikeyan, Robert Moody et al. · 2011 · 34 citations

Engineering, Computer Engineering, Electrical Engineering +17