IEEE Transactions on Components and Packaging Technologies

Venue (Journal)

Also Known As

Components and packaging technologies, IEEE transactions on, Institute of Electrical and Electronics Engineers transactions on components and packaging technologies, Transactions on components and packaging technologies, Components and packaging technologies

1.5K

Publications

41K

Citations

507

Concepts

About

IEEE Transactions on Components and Packaging Technologies is a journal.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	86	825	38.2K
2	Business	10	10	427
3	Education	10	11	491
4	Language Studies	2	2	29
5	Health Sciences	1	1	28

IEEE Transactions on Components and Packaging Technologies

1.5K

Publications

41K

Citations

Showing yearly statistics from 2000-2026.

Page 1

	Year	Citations
Assessment of high-heat-flux thermal management schemes Issam Mudawar IEEE Transactions on Components and Packaging Technologies EngineeringDetachable Heat SinksHeat RecoveryEnergy EfficiencyEnergy Management	2001	895
Dynamic lithium-ion battery model for system simulation Lijun Gao, Shengyi Liu, Roger A. Dougal IEEE Transactions on Components and Packaging Technologies Electric BatteryElectrical EngineeringEngineeringEnergy ManagementEnergy Efficiency	2002	782
Power and life extension of battery-ultracapacitor hybrids Roger A. Dougal, S. Liu, Ralph E. White IEEE Transactions on Components and Packaging Technologies Electric BatteryElectrical EngineeringEnergy HarvestingSupercapacitorsEngineering	2002	520
Thermal Challenges in Next-Generation Electronic Systems Suresh V. Garimella, Amy S. Fleischer, Jayathi Y. Murthy, IEEE Transactions on Components and Packaging Technologies EngineeringThermal ChallengesRefrigerationNanoelectronicsThermal Analysis	2008	468
Prognostics and health management of electronics N. Vichare, Michael Pecht IEEE Transactions on Components and Packaging Technologies EngineeringDiagnosisReliability EngineeringSystems EngineeringElectronic Packaging	2006	417
Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material John G. Bai, Ziyang Zhang, Jesus N. Calata, IEEE Transactions on Components and Packaging Technologies EngineeringMetallic NanomaterialsWafer Scale ProcessingNanoelectronicsMicrometer-size Porosity	2006	365
Four decades of research on thermal contact, gap, and joint resistance in microelectronics M. M. Yovanovich IEEE Transactions on Components and Packaging Technologies EngineeringThermal ContactMechanical EngineeringSoft MatterThermal Conductivity	2005	353
Dense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface Materials Tao Tong, Yang Zhao, Lance Delzeit, IEEE Transactions on Components and Packaging Technologies EngineeringCarbon NanotechnologyThermal ConductivityThermal ConductanceElectronic Devices	2007	326
A precise numerical prediction of effective dielectric constant for polymer-ceramic composite based on effective-medium theory Ching‐Ping Wong, Thomas F. Marinis, Jianmin Qu, IEEE Transactions on Components and Packaging Technologies Materials ScienceMaterials EngineeringElectrical EngineeringCeramic Matrix CompositeEngineering	2000	310
Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints Thomas R. Bieler, Hairong Jiang, L.P. Lehman, IEEE Transactions on Components and Packaging Technologies Friction WeldingEngineeringSevere Plastic DeformationMechanical EngineeringDifferent Orientations	2008	257

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