Suresh V. Garimella

Thermal Challenges in Next-Generation Electronic Systems

Suresh V. Garimella, Amy S. Fleischer, Jayathi Y. Murthy et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 468 citations

Engineering, Thermal Challenges, Refrigeration +18

A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Kevin P. Drummond, Doosan Back, Michael D. Sinanis et al. · International Journal of Heat and Mass Transfer · 2017 · 384 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +10

Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Suresh V. Garimella, Tim Persoons, Justin A. Weibel et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 227 citations · Full text

Engineering, Energy Efficiency, Thermal Management Challenges +20

Continuous Oil–Water Separation Using Polydimethylsiloxane-Functionalized Melamine Sponge

Xuemei Chen, Justin A. Weibel, Suresh V. Garimella · Industrial & Engineering Chemistry Research · 2016 · 195 citations

Chemical Engineering, Chemical Enhanced Oil Recovery, Engineering +14

Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions

Kevin P. Drummond, Doosan Back, Michael D. Sinanis et al. · International Journal of Heat and Mass Transfer · 2018 · 166 citations

Heat Transfer Process, Engineering, Microfabrication +9