A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Describing the uncertainties in experimental results

R. J. Moffat · Experimental Thermal and Fluid Science · 1988 · 9.6K citations

Computing, Data Science, Experimental Design +16

High-performance heat sinking for VLSI

David B. Tuckerman, R. F. W. Pease · IEEE Electron Device Letters · 1981 · 5.2K citations

Engineering, Computer Engineering, Electrical Engineering +17

High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks

Morris B. Bowers, Issam Mudawar · International Journal of Heat and Mass Transfer · 1994 · 482 citations

Engineering, Mechanical Engineering, Physics +17

A composite heat transfer correlation for saturated flow boiling in small channels

Stefan S. Bertsch, Eckhard A. Groll, Suresh V. Garimella · International Journal of Heat and Mass Transfer · 2008 · 450 citations

Engineering, Mechanical Engineering, Physics +14

Present and future thermal interface materials for electronic devices

Kafil M. Razeeb, Eric Dalton, Graham L. W. Cross et al. · International Materials Reviews · 2017 · 405 citations

Engineering, Electrical Engineering, Materials Science +17