Heat Sinks

Heat Sinks is a thermal management component designed to absorb and dissipate conductive heat from electronic devices through extended surface area, thereby reducing thermal resistance and preventing overheating.

2.9K

Publications

162.4K

Citations

7.2K

Authors

1.7K

Institutions

Publications per year

2017–2026

1.4K

Variants

Heat Sink

Authors

7.2K

  1. GX
    Gongnan Xie

    Northwestern Polytechnical University, China

    36 publications · 2.3K citations

    30

    h-index

  2. IM
    Issam Mudawar

    Purdue University West Lafayette, United States

    29 publications · 6.3K citations

    26

    h-index

  3. HM
    Hafız Muhammad Ali

    King Fahd University of Petroleum and Minerals, Saudi Arabia

    32 publications · 3.8K citations

    26

    h-index

  4. CW
    Chi‐Chuan Wang

    National Yang Ming Chiao Tung University, Taiwan

    34 publications · 1.4K citations

    25

    h-index

  5. GX
    Guodong Xia

    Beijing University of Technology, China

    25 publications · 2.9K citations

    23

    h-index

1–5 of 7.2K

Venues

  1. International Journal of Heat and Mass Transfer

    370 publications · 33.9K citations

    102

    h-index

  2. Applied Thermal Engineering

    329 publications · 22.2K citations

    81

    h-index

  3. 57

    h-index

  4. International Journal of Thermal Sciences

    IJTS · 136 publications · 8.2K citations

    51

    h-index

  5. Energy Conversion and Management

    60 publications · 5.2K citations

    44

    h-index

1–5