Doosan Back

A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Kevin P. Drummond, Doosan Back, Michael D. Sinanis et al. · International Journal of Heat and Mass Transfer · 2017 · 384 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +10

Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions

Kevin P. Drummond, Doosan Back, Michael D. Sinanis et al. · International Journal of Heat and Mass Transfer · 2018 · 166 citations

Heat Transfer Process, Engineering, Microfabrication +9

Design, Fabrication, and Characterization of a Compact Hierarchical Manifold Microchannel Heat Sink Array for Two-Phase Cooling

Doosan Back, Kevin P. Drummond, Michael D. Sinanis et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 74 citations

Engineering, Liquid Metal Cooling, Compact Heat Sink +18

Single-Layer Graphene as a Barrier Layer for Intense UV Laser-Induced Damages for Silver Nanowire Network

Suprem R. Das, Qiong Nian, Mojib Saei et al. · ACS Nano · 2015 · 71 citations

Materials Science, Graphene Nanomeshes, Electrical Engineering +15

Evaporative intrachip hotspot cooling with a hierarchical manifold microchannel heat sink array

Kevin P. Drummond, Justin A. Weibel, Suresh V. Garimella et al. · 2016 · 40 citations

Engineering, Liquid Metal Cooling, Chip Temperature Uniformity +19