Concepedia

Author

Doosan Back

Purdue University West LafayetteORCID

Also Known As

D. Back, Doosan Back

9

Publications

769

Citations

7

H-Index

26

Concepts

All Affiliations

Purdue University West Lafayette
DB

About

Doosan Back is an author at Purdue University West Lafayette specializing in engineering, microfluidics, and microelectronics.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

6

6

757

2

Electrical Engineering

3

3

477

3

Applied Physics

2

2

93

4

Computer Engineering

2

2

114

5

Materials Science

1

1

71

Doosan Back

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6

Publications

757

Citations

6

H-Index

YearCitations

A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Kevin P. Drummond, Doosan Back, Michael D. Sinanis,

International Journal of Heat and Mass Transfer

2017

384

Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions

Kevin P. Drummond, Doosan Back, Michael D. Sinanis,

International Journal of Heat and Mass Transfer

2018

166

Design, Fabrication, and Characterization of a Compact Hierarchical Manifold Microchannel Heat Sink Array for Two-Phase Cooling

Doosan Back, Kevin P. Drummond, Michael D. Sinanis,

IEEE Transactions on Components Packaging and Manufacturing Technology

2019

74

Single-Layer Graphene as a Barrier Layer for Intense UV Laser-Induced Damages for Silver Nanowire Network

Suprem R. Das, Qiong Nian, Mojib Saei,

ACS Nano

2015

71

Evaporative intrachip hotspot cooling with a hierarchical manifold microchannel heat sink array

Kevin P. Drummond, Justin A. Weibel, Suresh V. Garimella,

2016

40

Snapback Induced Gate Dielectric Breakdown in Graded Junction MOS Structures

S.N. Shabde, G. Simmons, Abhishek Baluni,

Reliability physics

1984

22

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