Jun Fan

Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions

Jun Fan, Xiaoning Ye, Jingook Kim et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 290 citations

Hardware Security, Transmission Lines, Electrical Engineering +14

An Improved Dipole-Moment Model Based on Near-Field Scanning for Characterizing Near-Field Coupling and Far-Field Radiation From an IC

Zhenwei Yu, Jason Mix, Soji Sajuyigbe et al. · IEEE Transactions on Electromagnetic Compatibility · 2012 · 214 citations

Engineering, Radio Frequency, Sensor Array +19

Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Renato Rímolo-Donadío, Xiaoxiong Gu, Young Kwark et al. · IEEE Transactions on Microwave Theory and Techniques · 2009 · 174 citations

Engineering, Physics-based Via, Structural Optimization +22

Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages

Yaojiang Zhang, Jun Fan, G. Selli et al. · IEEE Transactions on Microwave Theory and Techniques · 2008 · 152 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs

Jun Fan, James L. Drewniak, J.L. Knighten et al. · IEEE Transactions on Electromagnetic Compatibility · 2001 · 135 citations

Local Decoupling, Engineering, Power Optimization (Eda) +18