Yaojiang Zhang

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er‐Ping Li, Xing‐Chang Wei, A.C. Cangellaris et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 206 citations

Em Compatibility, Engineering, Printed Circuit Boards +20

A 2.5-D Angularly Stable Frequency Selective Surface Using Via-Based Structure for 5G EMI Shielding

Da Li, Tianwu Li, Er‐Ping Li et al. · IEEE Transactions on Electromagnetic Compatibility · 2017 · 184 citations

Electrical Engineering, New Design, Engineering +12

Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Renato Rímolo-Donadío, Xiaoxiong Gu, Young Kwark et al. · IEEE Transactions on Microwave Theory and Techniques · 2009 · 174 citations

Engineering, Physics-based Via, Structural Optimization +22

Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages

Yaojiang Zhang, Jun Fan, G. Selli et al. · IEEE Transactions on Microwave Theory and Techniques · 2008 · 152 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis

Yaojiang Zhang, Jun Fan · IEEE Transactions on Microwave Theory and Techniques · 2010 · 99 citations

Electrical Engineering, Multiple Vias, Engineering +13