Concepedia

Pradeep Lall

PL

256

Publications

7.7K

Citations

46

H-Index

1990

Active since

Affiliations

Auburn University(Current)

Ames Research Center

United States Department of the Army

Pradeep Lall is an author at Auburn University specializing in engineering, electronic packaging, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsMaterial ScienceMicrostructureSolid MechanicsElectrical EngineeringReliability EngineeringStructural Health Monitoring

Publications per year

1990–2024

256

Publications

256

Determination of Anand constants for SAC solders using stress-strain or creep data

Mohammad Motalab, Zijie Cai, Jeffrey C. Suhling et al. · 2012 · 189 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +19

The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints

Hongtao Ma, Jeffrey C. Suhling, Yifei Zhang et al. · 2007 · 151 citations

Materials Science, Room Temperature, Engineering +14

Reliability of the Aging Lead Free Solder Joint

Hongtao Ma, Jeffrey C. Suhling, Pradeep Lall et al. · 2006 · 149 citations

Engineering, Mechanical Engineering, Evolving Microstructure +17

Model for BGA and CSP Reliability in Automotive Underhood Applications

Pradeep Lall, Md Nazmul Islam, Naveen K. Singh et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 133 citations

Engineering, Mechanical Engineering, System Reliability +24

Reduction of lead free solder aging effects using doped SAC alloys

Zijie Cai, Yifei Zhang, Jeffrey C. Suhling et al. · 2010 · 128 citations

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