Pradeep Lall

Determination of Anand constants for SAC solders using stress-strain or creep data

Mohammad Motalab, Zijie Cai, Jeffrey C. Suhling et al. · 2012 · 193 citations

Natural Sciences, Materials Engineering, Materials Science +17

The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints

Hongtao Ma, Jeffrey C. Suhling, Yifei Zhang et al. · 2007 · 152 citations

Natural Sciences, Materials Engineering, Materials Science +16

Reliability of the Aging Lead Free Solder Joint

Hongtao Ma, Jeffrey C. Suhling, Pradeep Lall et al. · 2006 · 150 citations

Natural Sciences, Materials Engineering, Materials Science +16

Model for BGA and CSP Reliability in Automotive Underhood Applications

Pradeep Lall, Md Nazmul Islam, Naveen K. Singh et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 137 citations

Engineering, Automotive Engineering, Materials Engineering +17

Reduction of lead free solder aging effects using doped SAC alloys

Zijie Cai, Yifei Zhang, Jeffrey C. Suhling et al. · 2010 · 129 citations

Natural Sciences, Materials Engineering, Materials Science +17