Pradeep Lall

Determination of Anand constants for SAC solders using stress-strain or creep data

Mohammad Motalab, Zijie Cai, Jeffrey C. Suhling et al. · 2012 · 189 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +19

The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints

Hongtao Ma, Jeffrey C. Suhling, Yifei Zhang et al. · 2007 · 151 citations

Materials Science, Room Temperature, Engineering +14

Reliability of the Aging Lead Free Solder Joint

Hongtao Ma, Jeffrey C. Suhling, Pradeep Lall et al. · 2006 · 149 citations

Engineering, Mechanical Engineering, Evolving Microstructure +17

Model for BGA and CSP Reliability in Automotive Underhood Applications

Pradeep Lall, Md Nazmul Islam, Naveen K. Singh et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 133 citations

Engineering, Mechanical Engineering, System Reliability +24

Reduction of lead free solder aging effects using doped SAC alloys

Zijie Cai, Yifei Zhang, Jeffrey C. Suhling et al. · 2010 · 128 citations