Qiao Chen

Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

Xi Liu, Qiao Chen, Pradeep Dixit et al. · 2009 · 171 citations

Engineering, Mechanical Engineering, Integrated Circuits +22

Through-package-via formation and metallization of glass interposers

Vijay Sukumaran, Qiao Chen, Fuhan Liu et al. · 2010 · 119 citations

Engineering, Silicon Interposers, Glass-ceramic +17

Tumor Microenvironment Stimuli‐Responsive Fluorescence Imaging and Synergistic Cancer Therapy by Carbon‐Dot–Cu²⁺ Nanoassemblies

Shan Sun, Qiao Chen, Zhongdi Tang et al. · Angewandte Chemie · 2020 · 109 citations

Nanoparticles, Nanotherapeutics, Engineering +20

On the Benefits of Glide Symmetries for Microwave Devices

Óscar Quevedo-Teruel, Qiao Chen, Francisco Mesa et al. · IEEE Journal of Microwaves · 2021 · 96 citations · Full text

Electromagnetic Metamaterials, Glide Symmetries, Engineering +10

Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

Vijay Sukumaran, Tapobrata Bandyopadhyay, Qiao Chen et al. · 2011 · 81 citations

Package Vias, Engineering, Fine Pitch +21