Pradeep Dixit

Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

Xi Liu, Qiao Chen, Pradeep Dixit et al. · 2009 · 171 citations

Engineering, Mechanical Engineering, Integrated Circuits +22

Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating

Pradeep Dixit, Jianmin Miao · Journal of The Electrochemical Society · 2006 · 150 citations

Materials Science, Electrical Engineering, Wafer Scale Processing +13

Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

Luhua Xu, Pradeep Dixit, Jianmin Miao et al. · Applied Physics Letters · 2007 · 83 citations

Engineering, Interconnect (Integrated Circuits), High Density +18

Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging

Julfekar Arab, Dileep Kumar Mishra, Harindra Kumar Kannojia et al. · Journal of Materials Processing Technology · 2019 · 83 citations

Materials Science, Electrical Engineering, Engineering +11

Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM

Julfekar Arab, Harindra Kumar Kannojia, Pradeep Dixit · Precision Engineering · 2019 · 77 citations

Electrical Engineering, Engineering, Microfabrication +7