Pradeep Dixit

Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

Xi Liu, Qiao Chen, Pradeep Dixit et al. · 2009 · 172 citations

Engineering, Electrical Engineering, Materials Engineering +17

Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating

Pradeep Dixit, Jianmin Miao · Journal of The Electrochemical Society · 2006 · 150 citations

Engineering, Electrical Engineering, Materials Engineering +15

Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

Luhua Xu, Pradeep Dixit, Jianmin Miao et al. · Applied Physics Letters · 2007 · 84 citations

Natural Sciences, Materials Engineering, Materials Science +17

Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging

Julfekar Arab, Dileep Kumar Mishra, Harindra Kumar Kannojia et al. · Journal of Materials Processing Technology · 2019 · 84 citations

Engineering, Materials Engineering, Materials Science +14

Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM

Julfekar Arab, Harindra Kumar Kannojia, Pradeep Dixit · Precision Engineering · 2019 · 81 citations

Engineering, Manufacturing Engineering, Materials Engineering +3