Harindra Kumar Kannojia

Publications

274

Citations

H-Index

2018

Active since

Affiliations

Indian Institute of Technology Bombay(Current)

Research & Development Establishment (Engrs.)

Harindra Kumar Kannojia is an author at Indian Institute of Technology Bombay specializing in engineering, materials science, and electronic packaging.

ORCID

Top concepts

EngineeringMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingElectrical EngineeringApplied PhysicsSurface ScienceMechanical Engineering3D Printing

Publications per year

2018–2021

Publications

Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging

Julfekar Arab, Dileep Kumar Mishra, Harindra Kumar Kannojia et al. · Journal of Materials Processing Technology · 2019 · 83 citations

Materials Science, Electrical Engineering, Engineering +11

Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM

Julfekar Arab, Harindra Kumar Kannojia, Pradeep Dixit · Precision Engineering · 2019 · 77 citations

Electrical Engineering, Engineering, Microfabrication +7

Fabrication and Characterization of Through-Glass Vias by the ECDM Process

Harindra Kumar Kannojia, Julfekar Arab, Bhaskar Pegu et al. · Journal of The Electrochemical Society · 2019 · 59 citations

Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate

Harindra Kumar Kannojia, Aboobackkar Sidhique, Ambika Shanker Shukla et al. · Microsystem Technologies · 2021 · 19 citations

Advanced Packaging, Materials Science, Electrical Engineering +8

Void Formation and Intermetallic Growth in Pulse Electrodeposited Cu-Sn Layers for MEMS Packaging

Harindra Kumar Kannojia, Surender Kumar Sharma, Pradeep Dixit · Journal of Electronic Materials · 2018 · 14 citations

Materials Science, Electrical Engineering, Electromigration Technique +11

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