Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate

Conversions between S, Z, Y, H, ABCD, and T parameters which are valid for complex source and load impedances

Dean A. Frickey · IEEE Transactions on Microwave Theory and Techniques · 1994 · 651 citations

Engineering, Electrical Engineering, Circuit Theory +14

Machining of non-conducting materials using electrochemical discharge phenomenon—an overview

Rolf Wüthrich, Valia Fascio · International Journal of Machine Tools and Manufacture · 2005 · 346 citations · Full text

Engineering, Manufacturing Engineering, Materials Engineering +14

Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

Vijay Sukumaran, Tapobrata Bandyopadhyay, Venky Sundaram et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 273 citations

Engineering, Electrical Engineering, Materials Science +17

Characterization of masking layers for deep wet etching of glass in an improved HF/HCl solution

Ciprian Iliescu, Jing Ji, Francis E. H. Tay et al. · Surface and Coatings Technology · 2004 · 184 citations

Engineering, Materials Engineering, Materials Science +13

Micromachined planar inductors on silicon wafers for MEMS applications

Chang-Geun Ahn, Mark G. Allen · IEEE Transactions on Industrial Electronics · 1998 · 178 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +15