Venky Sundaram

Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

Vijay Sukumaran, Tapobrata Bandyopadhyay, Venky Sundaram et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 273 citations

Engineering, Electrical Engineering, Materials Science +17

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

Vijay Sukumaran, Gokul Kumar, Koushik Ramachandran et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 138 citations

Engineering, Electrical Engineering, Materials Science +17

Through-package-via formation and metallization of glass interposers

Vijay Sukumaran, Qiao Chen, Fuhan Liu et al. · 2010 · 123 citations

Engineering, Materials Engineering, Materials Science +17

Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

Vijay Sukumaran, Tapobrata Bandyopadhyay, Qiao Chen et al. · 2011 · 83 citations

Engineering, Materials Engineering, Materials Science +17

Trend from ICs to 3D ICs to 3D systems

Rao Tummala, Venky Sundaram, Ritwik Chatterjee et al. · 2009 · 58 citations

Engineering, Computer Engineering, Electrical Engineering +17