Fuhan Liu

Through-package-via formation and metallization of glass interposers

Vijay Sukumaran, Qiao Chen, Fuhan Liu et al. · 2010 · 119 citations

Engineering, Silicon Interposers, Glass-ceramic +17

Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

Vijay Sukumaran, Tapobrata Bandyopadhyay, Qiao Chen et al. · 2011 · 81 citations

Package Vias, Engineering, Fine Pitch +21

First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications

Muhammad Ali, Fuhan Liu, Atom O. Watanabe et al. · IEEE Microwave and Wireless Components Letters · 2018 · 74 citations

Electrical Engineering, Millimeter Wave Technology, Engineering +15

Reliability assessment of microvias in HDI printed circuit boards

Fuhan Liu, Jicun Lu, V. Sundaram et al. · IEEE Transactions on Components and Packaging Technologies · 2002 · 45 citations

Engineering, Reliability Assessment, Thermal Shock +20

45 Degree Polymer Micromirror Integration for Board-Level Three-Dimensional Optical Interconnects

Fengtao Wang, Fuhan Liu, Ali Adibi · Optics Express · 2009 · 42 citations · Full text

Optical Materials, Engineering, Device Integration +20