V. Sundaram

The SOP for Miniaturized, Mixed-Signal Computing, Communication, and Consumer Systems of the Next Decade

Rao Tummala, Madhavan Swaminathan, Manos M. Tentzeris et al. · IEEE Transactions on Advanced Packaging · 2004 · 152 citations

Engineering, Computer Engineering, Electrical Engineering +15

Impact of Bran Filler Amount on Flax Fiber Reinforced Epoxy Composite - Mechanical and Thermal Properties for Secondary Structural Applications

Thandavamoorthy Raja, D. Yuvarajan, V. Sundaram et al. · International Journal of Mechanical Engineering · 2024 · 73 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Reliability assessment of microvias in HDI printed circuit boards

Fuhan Liu, Jicun Lu, V. Sundaram et al. · IEEE Transactions on Components and Packaging Technologies · 2002 · 46 citations

Engineering, Electrical Engineering, Materials Engineering +17

Next-Generation Microvia and Global Wiring Technologies for SOP

V. Sundaram, Rao Tummala, Fuhan Liu et al. · IEEE Transactions on Advanced Packaging · 2004 · 42 citations

Engineering, Computer Engineering, Electrical Engineering +16

Chip-to-Chip Optoelectronics SOP on Organic Boards or Packages

Gee‐Kung Chang, Daniel Guidotti, Fuhan Liu et al. · IEEE Transactions on Advanced Packaging · 2004 · 37 citations

Engineering, Electrical Engineering, Materials Science +17