Ritwik Chatterjee

Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

Xi Liu, Qiao Chen, Pradeep Dixit et al. · 2009 · 171 citations

Engineering, Mechanical Engineering, Integrated Circuits +22

Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits

Ankur Jain, Robert E. Jones, Ritwik Chatterjee et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 170 citations

Numerical Analysis, Engineering, Integrated Circuits +24

Electrical modeling of Through Silicon and Package Vias

Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung et al. · 2009 · 122 citations

Device Modeling, Electrical Engineering, Semiconductor Device +14

Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects

Tapobrata Bandyopadhyay, Ki Jin Han, Daehyun Chung et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 102 citations

Engineering, Power Electronics, Interconnect (Integrated Circuits) +18

Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits

Ioannis Savidis, Syed M. Alam, Ankur Jain et al. · Microelectronics Journal · 2009 · 80 citations