Concepedia

Author

Daehyun Chung

Georgia Institute of Technology

Also Known As

D.I. Chung, Dae-Hyun Chung, Daehyun Chung

54

Publications

647

Citations

11

H-Index

34

Concepts

All Affiliations

Georgia Institute of TechnologyIBM (United States)Chungbuk National UniversityNvidia (United States)Korea Advanced Institute of Science and Technology
DC

About

Daehyun Chung is an author at Georgia Institute of Technology specializing in engineering, electrical engineering, and microelectronics.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

10

10

540

2

Electrical Engineering

9

9

528

3

Computer Engineering

6

6

356

4

Applied Physics

2

2

127

5

Systems Engineering

2

2

166

Daehyun Chung

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11

Publications

565

Citations

11

H-Index

YearCitations

Designing and Modeling for Power Integrity

Madhavan Swaminathan, Daehyun Chung, S. Grivet‐Talocia,

IEEE Transactions on Electromagnetic Compatibility

2010

145

Electrical modeling of Through Silicon and Package Vias

Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung,

2009

122

Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects

Tapobrata Bandyopadhyay, Ki Jin Han, Daehyun Chung,

IEEE Transactions on Components Packaging and Manufacturing Technology

2011

102

High frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-D chip stacking package

Chunghyun Ryu, Daehyun Chung, Jun Ho Lee,

2006

53

Diarctigenin, a Lignan Constituent from Arctium lappa, Down-Regulated Zymosan-Induced Transcription of Inflammatory Genes through Suppression of DNA Binding Ability of Nuclear Factor-κB in Macrophages

Byung Hak Kim, Seong Su Hong, Soon Woo Kwon,

Journal of Pharmacology and Experimental Therapeutics

2008

25

Electrical modeling of annular and co-axial TSVs considering MOS capacitance effects

Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung,

2009

25

A Novel Synthesis Method for Designing Electromagnetic Band Gap (EBG) Structures in Packaged Mixed Signal Systems

Tae Hong Kim, Daehyun Chung, E. Engin,

2006

25

Electrical-thermal co-analysis for power delivery networks in 3D system integration

Jianyong Xie, Daehyun Chung, Madhavan Swaminathan,

2009

21

Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

Jinwoo Choi, Dong Gun Kam, Daehyun Chung,

IEEE Transactions on Advanced Packaging

2007

18

Achieving near zero SSN power delivery networks by eliminating power planes and using constant current power transmission lines

Suzanne Huh, Daehyun Chung, Madhavan Swaminathan

2009

17

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