Daehyun Chung

Designing and Modeling for Power Integrity

Madhavan Swaminathan, Daehyun Chung, S. Grivet‐Talocia et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 145 citations

Engineering, Power Electronics, Electromagnetic Compatibility +20

Electrical modeling of Through Silicon and Package Vias

Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung et al. · 2009 · 122 citations

Device Modeling, Electrical Engineering, Semiconductor Device +14

Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects

Tapobrata Bandyopadhyay, Ki Jin Han, Daehyun Chung et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 102 citations

Engineering, Power Electronics, Interconnect (Integrated Circuits) +18

High frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-D chip stacking package

Chunghyun Ryu, Daehyun Chung, Jun Ho Lee et al. · 2006 · 53 citations

Engineering, Vlsi Design, Vector Network +16

Diarctigenin, a Lignan Constituent from Arctium lappa, Down-Regulated Zymosan-Induced Transcription of Inflammatory Genes through Suppression of DNA Binding Ability of Nuclear Factor-κB in Macrophages

Byung Hak Kim, Seong Su Hong, Soon Woo Kwon et al. · Journal of Pharmacology and Experimental Therapeutics · 2008 · 25 citations