Syed M. Alam - Concepedia

Author

Syed M. Alam

Everspin Technologies (United States)

Also Known As

Alam, Syed M., SYED M. ALAM, Syed M. Alam

Publications

778

Citations

H-Index

Concepts

All Affiliations

Everspin Technologies (United States)Tufts University University of South Florida Georgia Institute of Technology

About

Syed M. Alam is an author at Everspin Technologies (United States) specializing in engineering, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	13	490
2	Applied Physics	3	3	114
3	Education	1	1	18
4	Natural Sciences	1	1	51
5	Social Sciences	1	1	17

Syed M. Alam

Publications

600

Citations

H-Index

Page 1

	Year	Citations
Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies Nauman Khan, Syed M. Alam, Soha Hassoun IEEE Transactions on Very Large Scale Integration (VLSI) Systems EngineeringComputer ArchitectureIntegrated CircuitsInterconnect (Integrated Circuits)Physical Design (Electronics)	2010	117
Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits Ioannis Savidis, Syed M. Alam, Ankur Jain, Microelectronics Journal	2009	80
System-level comparison of power delivery design for 2D and 3D ICs Nauman Khan, Syed M. Alam, Soha Hassoun EngineeringVlsi DesignEnergy EfficiencyComputer ArchitectureIntegrated Circuits	2009	58
Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs Nauman Khan, Syed M. Alam, Soha Hassoun EngineeringCoaxial TsvsIntegration TechnologyThrough-silicon ViaNoise Reduction	2009	52
Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology Syed M. Alam, Robert E. Jones, Shahid Rauf, EngineeringDevice IntegrationIntegrated CircuitsIntegration TechnologyInterconnect (Integrated Circuits)	2007	52
Low Power Magnetic Quantum Cellular Automata Realization Using Magnetic Multi-Layer Structures Jayita Das, Syed M. Alam, Sanjukta Bhanja IEEE Journal on Emerging and Selected Topics in Circuits and Systems Non-volatile MemoryEngineeringMagnetic ResonanceMqca RealizationNanocomputing	2011	51
Ultra-Low Power Hybrid CMOS-Magnetic Logic Architecture Jayita Das, Syed M. Alam, Sanjukta Bhanja IEEE Transactions on Circuits and Systems I Regular Papers Non-volatile MemoryEngineeringMagnetic ResonanceComputer ArchitectureDipolar Magnetic Coupling	2012	39
Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Microelectronics Journal	2007	30
Interstratum Connection Design Considerations for Cost-Effective 3-D System Integration Syed M. Alam, Robert E. Jones, Scott Pozder, IEEE Transactions on Very Large Scale Integration (VLSI) Systems Interstratum PowerElectrical Engineering3D Ic ArchitectureEngineeringDevice Integration	2009	20
Mitigating TSV-induced substrate noise in 3-D ICs using GND plugs Nauman Khan, Syed M. Alam, Soha Hassoun 3D Ic ArchitectureElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Electronic Engineering	2011	19

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