Concepedia

Syed M. Alam

SM

15

Publications

600

Citations

14

H-Index

2007

Active since

Affiliations

Everspin Technologies (United States)(Current)

Tufts University

University of South Florida

Georgia Institute of Technology

Syed M. Alam is an author at Everspin Technologies (United States) specializing in engineering, microelectronics, and electrical engineering.

Top concepts

EngineeringMicroelectronicsElectrical EngineeringComputer EngineeringElectronic PackagingComputer Architecture3D IntegrationMagnetism3D PrintingIntegrated Circuits

Publications per year

2007–2022

15

Publications

15

Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies

Nauman Khan, Syed M. Alam, Soha Hassoun · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2010 · 117 citations

Engineering, Computer Architecture, Integrated Circuits +16

Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits

Ioannis Savidis, Syed M. Alam, Ankur Jain et al. · Microelectronics Journal · 2009 · 80 citations

System-level comparison of power delivery design for 2D and 3D ICs

Nauman Khan, Syed M. Alam, Soha Hassoun · 2009 · 58 citations

Engineering, Vlsi Design, Energy Efficiency +20

Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs

Nauman Khan, Syed M. Alam, Soha Hassoun · 2009 · 52 citations

Engineering, Coaxial Tsvs, Integration Technology +17

Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology

Syed M. Alam, Robert E. Jones, Shahid Rauf et al. · 2007 · 52 citations

Engineering, Device Integration, Integrated Circuits +20

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