Koushik Ramachandran

Author

Georgia Institute of Technology ORCID

Also Known As

K Ramachandran, K. Ramachandran, Koushik Ramachandran, Ramachandran, K., Ramachandran, Koushik

Publications

331

Citations

H-Index

Concepts

All Affiliations

Georgia Institute of Technology GlobalFoundries (United States)IBM (United States)

About

Koushik Ramachandran is an author at Georgia Institute of Technology specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	5	5	239
2	Applied Physics	3	3	197
3	Electrical Engineering	2	2	160
4	Materials Engineering	2	2	60
5	Computer Engineering	1	1	17

Koushik Ramachandran

Publications

271

Citations

H-Index

Page 1

	Year	Citations
Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon Vijay Sukumaran, Gokul Kumar, Koushik Ramachandran, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringSignal Insertion LossIntegrated CircuitsSame PitchInterconnect (Integrated Circuits)	2014	135
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates Katsuyuki Sakuma, Krishna Tunga, Buck Webb, EngineeringMechanical EngineeringLarge DieIntegrated CircuitsOrganic Substrates	2015	35
3D Integrated Laser Attach Technology on a 300-mm Monolithic CMOS Silicon Photonics Platform Yusheng Bian, Koushik Ramachandran, Zhuo-Jie Wu, IEEE Journal of Selected Topics in Quantum Electronics PhotonicsOptical MaterialsEngineeringWafer Scale ProcessingIntegrated Photonics	2023	27
Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages Kaya Demir, Koushik Ramachandran, Yoichiro Sato, Thermomechanical ReliabilityElectrochemical ReliabilityEngineeringMechanical EngineeringInterconnect (Integrated Circuits)	2013	25
Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications Kaya Demir, Vijay Sukumaran, Yoichiro Sato, Journal of Materials Science Materials in Electronics Fine-pitch Through-vias3D Ic ArchitectureHigh-bandwidth ComputingEngineeringChip-scale Package	2018	17
Harmonic manifolds with some specific volume densities Koushik Ramachandran, Akhil Ranjan Proceedings - Mathematical Sciences Manifold ModelingRiemannian ManifoldHarmonic SpaceHarmonic Manifolds	1997	11
End-to-End Integration of a Multi-die Glass Interposer for System Scaling Applications Brittany Hedrick, Vijay Sukumaran, Benjamin Fasano,	2016	11
3D Integrated Laser Attach Technology on 300-mm Monolithic Silicon Photonics Platform Yusheng Bian, Koushik Ramachandran, Bo Peng,	2020	10

Page 1