Koushik Ramachandran

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

Vijay Sukumaran, Gokul Kumar, Koushik Ramachandran et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 135 citations

Engineering, Signal Insertion Loss, Integrated Circuits +18

An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates

Katsuyuki Sakuma, Krishna Tunga, Buck Webb et al. · 2015 · 35 citations

Engineering, Mechanical Engineering, Large Die +24

3D Integrated Laser Attach Technology on a 300-mm Monolithic CMOS Silicon Photonics Platform

Yusheng Bian, Koushik Ramachandran, Zhuo-Jie Wu et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2023 · 27 citations

Photonics, Optical Materials, Engineering +14

Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages

Kaya Demir, Koushik Ramachandran, Yoichiro Sato et al. · 2013 · 25 citations

Thermomechanical Reliability, Electrochemical Reliability, Engineering +21

Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications

Kaya Demir, Vijay Sukumaran, Yoichiro Sato et al. · Journal of Materials Science Materials in Electronics · 2018 · 17 citations

Fine-pitch Through-vias, 3D Ic Architecture, High-bandwidth Computing +12