1
Publications
35
Citations
1
H-Index
2015
Active since
Affiliations
Buck Webb is an author at IBM Research - Thomas J. Watson Research Center specializing in advanced packaging, materials engineering, and integrated circuits.
Top concepts
3D PrintingEngineeringSelf-assembly3D IntegrationApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationAdvanced PackagingIntegrated Circuits
Publications per year
2015–2015
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