Three-dimensional silicon integration

John Knickerbocker, Paul Andry, B. Dang, +13

IBM Journal of Research and Development

EngineeringDevice IntegrationIntegrated CircuitsSilicon On InsulatorInterconnect (Integrated Circuits) +20

Future system-on-silicon LSI chips

Mitsumasa Koyanagi, H. Kurino, Kang Wook Lee, +3

IEEE Micro

EngineeringVlsi DesignDevice IntegrationComputer ArchitectureInterconnect (Integrated Circuits) +15

3D silicon integration

John Knickerbocker, Paul Andry, B. Dang, +8

EngineeringDevice IntegrationChip IntegrationComputer ArchitectureChip Integration Structures +17

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Katsuyuki Sakuma, Paul Andry, Cornelia Tsang, +10

IBM Journal of Research and Development

EngineeringLead-free SolderComputer ArchitectureChip-stacking TechnologyIntegrated Circuits +18

New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method

Takuji Matsumoto, Masakazu Satoh Masakazu Satoh, Katsuyuki Sakuma, +4

Japanese Journal of Applied Physics

Materials Science3D Ic ArchitectureWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors) +13

Intelligent image sensor chip with three dimensional structure

H. Kurino, K.W. Lee, T. Nakamura, +7

EngineeringDevice IntegrationIntegration TechnologyImage SensorWafer Scale Processing +19

3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections

Katsuyuki Sakuma, Paul Andry, B. Dang, +10

Imc LayersEngineeringMechanical EngineeringLead-free SolderComputer Architecture +18

IMC bonding for 3D interconnection

Katsuyuki Sakuma, Kuniaki Sueoka, Sayuri Kohara, +9

EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)Electronic Packaging +14

Heterogeneous Integration Technology Demonstrations for Future Healthcare, IoT, and AI Computing Solutions

John Knickerbocker, R. Budd, B. Dang, +11

Artificial IntelligenceHealthcare Monitoring SystemsEngineeringDiagnosisWearable Technology +27

3D chip stacking with C4 technology

B. Dang, S. L. Wright, Paul Andry, +11

IBM Journal of Research and Development

EngineeringComputer ArchitectureComputer-aided DesignIntegrated CircuitsIntegration Technology +19