Concepedia

H. Kurino

HK

Statistics

Publications

21

Citations

1.3K

H-Index

16

Active since

1988

Affiliations

Tohoku University(Current)

Kajima Corporation (Japan)

Mitsubishi Heavy Industries (Germany)

Fuji Xerox (Japan)

H. Kurino is an author at Tohoku University specializing in engineering, civil engineering, and structural dynamics.

Publications per year

1988–2019

21

Publications

21

Future system-on-silicon LSI chips

Mitsumasa Koyanagi, H. Kurino, Kang Wook Lee et al. · IEEE Micro · 1998 · 336 citations

Engineering, Computer Engineering, Electrical Engineering +17

Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

Mitsumasa Koyanagi, T. Nakamura, Yusuke Yamada et al. · IEEE Transactions on Electron Devices · 2006 · 221 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Three-dimensional shared memory fabricated using wafer stacking technology

K.W. Lee, T. Nakamura, Takahito Ono et al. · 2002 · 141 citations

Engineering, Computer Engineering, Computer Science +17

Neuromorphic vision chip fabricated using three-dimensional integration technology

Mitsumasa Koyanagi, Yasuo Nakagawa, Kangwook Lee et al. · 2002 · 114 citations

Life Sciences, Neuroscience, Computer Vision +16

Intelligent image sensor chip with three dimensional structure

H. Kurino, K.W. Lee, T. Nakamura et al. · 2003 · 88 citations

Engineering, Manufacturing Engineering, Microelectromechanical Systems +16

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