Mitsumasa Koyanagi

Future system-on-silicon LSI chips

Mitsumasa Koyanagi, H. Kurino, Kang Wook Lee et al. · IEEE Micro · 1998 · 336 citations

Engineering, Computer Engineering, Electrical Engineering +17

High-Density Through Silicon Vias for 3-D LSIs

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka · Proceedings of the IEEE · 2009 · 296 citations

Engineering, Electrical Engineering, Materials Science +17

Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

Mitsumasa Koyanagi, T. Nakamura, Yusuke Yamada et al. · IEEE Transactions on Electron Devices · 2006 · 221 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Three-dimensional shared memory fabricated using wafer stacking technology

K.W. Lee, T. Nakamura, Takahito Ono et al. · 2002 · 141 citations

Engineering, Computer Engineering, Computer Science +17

Hot-electron-induced punchthrough (HEIP) effect in submicrometer PMOSFET's

Mitsumasa Koyanagi, A.G. Lewis, Richard J. Martin et al. · IEEE Transactions on Electron Devices · 1987 · 135 citations

Engineering, Electrical Engineering, Electronic Materials +16