Takafumi Fukushima

High-Density Through Silicon Vias for 3-D LSIs

Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka · Proceedings of the IEEE · 2009 · 296 citations

Engineering, Electrical Engineering, Materials Science +17

Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

Mitsumasa Koyanagi, T. Nakamura, Yusuke Yamada et al. · IEEE Transactions on Electron Devices · 2006 · 221 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems

Kangwook Lee, Akihiro Noriki, K. Kiyoyama et al. · IEEE Transactions on Electron Devices · 2011 · 103 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

New three-dimensional integration technology using self-assembly technique

Takafumi Fukushima, Yusuke Yamada, H. Kikuchi et al. · 2006 · 103 citations · Full text

Engineering, Computer Engineering, Computer Architecture +14

New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique

Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada et al. · 2007 · 94 citations · Full text

Engineering, Manufacturing Engineering, Computer-integrated Manufacturing +13