Akihiro Noriki

Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems

Kangwook Lee, Akihiro Noriki, K. Kiyoyama et al. · IEEE Transactions on Electron Devices · 2011 · 101 citations

Engineering, Device Integration, Integrated Photonics +22

Three-dimensional integration technology based on reconfigured wafer-to-wafer and multichip-to-wafer stacking using self-assembly method

Takafumi Fukushima, Eiji Iwata, Yuki Ohara et al. · 2009 · 56 citations

Engineering, Device Integration, Integrated Circuits +22

New heterogeneous multi-chip module integration technology using self-assembly method

Takafumi Fukushima, Toshihiro Konno, K. Kiyoyama et al. · 2008 · 54 citations

Self-assembly Method, Electrical Engineering, Engineering +15

Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding

M. Murugesan, J. Bea, Hisashi Kino et al. · 2009 · 43 citations

Engineering, Mechanical Engineering, Integrated Circuits +20

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma et al. · 2009 · 39 citations

Engineering, Wafer Scale Processing, Advanced Packaging (Semiconductors) +18