Hisashi Kino

Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias

M. Murugesan, Hisashi Kino, Hiroshi Nohira et al. · 2010 · 81 citations

Engineering, Mechanical Engineering, Integrated Circuits +22

New heterogeneous multi-chip module integration technology using self-assembly method

Takafumi Fukushima, Toshihiro Konno, K. Kiyoyama et al. · 2008 · 54 citations

Self-assembly Method, Electrical Engineering, Engineering +15

Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film

Takafumi Fukushima, J. C. Bea, Hisashi Kino et al. · IEEE Transactions on Electron Devices · 2014 · 45 citations

Engineering, Device Integration, Integrated Circuits +21

High density 3D LSI technology using W/Cu hybrid TSVs

M. Murugesan, Hisashi Kino, A. Hashiguchi et al. · 2011 · 44 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding

M. Murugesan, J. Bea, Hisashi Kino et al. · 2009 · 43 citations

Engineering, Mechanical Engineering, Integrated Circuits +20