J. C. Bea

Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits

Takafumi Fukushima, Eiji Iwata, Toshihiro Konno et al. · Applied Physics Letters · 2010 · 79 citations

Engineering, Integrated Circuits, Wafer Scale Processing +22

New heterogeneous multi-chip module integration technology using self-assembly method

Takafumi Fukushima, Toshihiro Konno, K. Kiyoyama et al. · 2008 · 54 citations

Self-assembly Method, Electrical Engineering, Engineering +15

Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation

Takafumi Fukushima, Eiji Iwata, Yuki Ohara et al. · IEEE Transactions on Electron Devices · 2012 · 47 citations

Engineering, Device Integration, Integrated Circuits +23

Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film

Takafumi Fukushima, J. C. Bea, Hisashi Kino et al. · IEEE Transactions on Electron Devices · 2014 · 45 citations

Engineering, Device Integration, Integrated Circuits +21

Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing

Takafumi Fukushima, Eiji Iwata, Yuki Ohara et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 42 citations

Engineering, Mechanical Engineering, Parallel Self-assembly +21