K. Kiyoyama

Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems

Kangwook Lee, Akihiro Noriki, K. Kiyoyama et al. · IEEE Transactions on Electron Devices · 2011 · 101 citations

Engineering, Device Integration, Integrated Photonics +22

New heterogeneous multi-chip module integration technology using self-assembly method

Takafumi Fukushima, Toshihiro Konno, K. Kiyoyama et al. · 2008 · 54 citations

Self-assembly Method, Electrical Engineering, Engineering +15

Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding

M. Murugesan, J. Bea, Hisashi Kino et al. · 2009 · 43 citations

Engineering, Mechanical Engineering, Integrated Circuits +20

3D heterogeneous opto-electronic integration technology for system-on-silicon (SOS)

Kyung-Woo Lee, Akihiro Noriki, K. Kiyoyama et al. · 2009 · 37 citations

Optical Materials, Engineering, Device Integration +20

Die-Level 3-D Integration Technology for Rapid Prototyping of High-Performance Multifunctionality Hetero-Integrated Systems

Kangwook Lee, Yuki Ohara, K. Kiyoyama et al. · IEEE Transactions on Electron Devices · 2013 · 29 citations

Engineering, Device Integration, Computer Architecture +20